- Research
- Research
- Publications
- PhD Theses
- Projects
- Academics
- Admissions
- M.Tech @ ESE
- Ph.D @ ESE
- DD MSc - Phd
- DD (B.Tech.-M.Tech.)
- B.Tech
- Minor in Energy
- Faculty Advisors
- Activities
- News and Events
- Seminars
- List of Holidays
Title | Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications |
Publication Type | Journal Article |
Year of Publication | 2017 |
Authors | Bajpai, V. K., P. Pant, and C. S. Solanki |
Journal | Solar Energy |
Volume | 155 |
Pagination | 62-74 |
URL | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85020884387&doi=10.1016%2fj.solener.2017.06.002&partnerID=40&md5=ff3fb4caf7eab8a934510b487655aee3 |
DOI | 10.1016/j.solener.2017.06.002 |