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Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process
Thu, 2021-07-22 16:09 — venkatr
| Title | Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process |
| Publication Type | Journal Article |
| Year of Publication | 2017 |
| Authors | Mathew, R. T., D. Mule, K. R. Balasubramaniam, and M. J. N. V. Prasad |
| Journal | Journal of Alloys and Compounds |
| Volume | 725 |
| Pagination | 818-823 |
| URL | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85026362325&doi=10.1016%2fj.jallcom.2017.07.205&partnerID=40&md5=a2ff62821054302934e91539fe4a0b3f |
| DOI | 10.1016/j.jallcom.2017.07.205 |