Enhanced Thermal Conductivity of Copper Nanofluids: The Effect of Filler Geometry

Thu, 2021-07-22 16:10 — venkatr
TitleEnhanced Thermal Conductivity of Copper Nanofluids: The Effect of Filler Geometry
Publication TypeJournal Article
Year of Publication2017
AuthorsBhanushali, S., N. N. Jason, P. Ghosh, A. Ganesh, G. P. Simon, and W. Cheng
JournalACS Applied Materials and Interfaces
Volume9
Pagination18925-18935
URLhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85020291998&doi=10.1021%2facsami.7b03339&partnerID=40&md5=048004815d25e6516787686b264c72f5
DOI10.1021/acsami.7b03339

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