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Surface quality and contamination on Si wafer surfaces sliced using wire-electrical discharge machining
Thu, 2021-07-22 16:11 — venkatr
| Title | Surface quality and contamination on Si wafer surfaces sliced using wire-electrical discharge machining |
| Publication Type | Journal Article |
| Year of Publication | 2019 |
| Authors | Joshi, K., P. Padhamnath, U. Bhandarkar, and S. S. Joshi |
| Journal | Journal of Engineering Materials and Technology, Transactions of the ASME |
| Volume | 141 |
| URL | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85079571642&doi=10.1115%2f1.4044374&partnerID=40&md5=22b7de8bc5fdb587fddccc4ab91943c8 |
| DOI | 10.1115/1.4044374 |