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Bhanushali, S., N. N. Jason, P. Ghosh, A. Ganesh, G. P. Simon, and W. Cheng. "Enhanced Thermal Conductivity of Copper Nanofluids: The Effect of Filler Geometry." ACS Applied Materials and Interfaces 9 (2017): 18925-18935.
Bhanushali, S., P. C. Ghosh, G. P. Simon, and W. Cheng. "Copper Nanowire-Filled Soft Elastomer Composites for Applications as Thermal Interface Materials." Advanced Materials Interfaces 4 (2017).

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